Kingston Technology FURY 16GB 3200MT/s DDR4 CL20 SODIMM Impact. Component for: Laptop, Internal memory: 16 GB, Memory layout (modules x size): 1 x 16 GB, Internal memory type: DDR4, Memory form factor: 260-pin SO-DIMM, CAS latency: 20
Get your notebook or small-form-factor machine fully equipped with Kingston FURY™ Impact DDR4 SODIMM and minimise system lag. Ready for AMD Ryzen™, Intel® XMP-ready and XMP Certified in kit capacities of up to 64GB, FURY Impact DDR4 features Kingston’s innovative Plug N Play* overclocking technology, which automatically engages the factory preset speed and latency timings without having to change any settings in the BIOS. Designed to run cool, quiet and efficiently at only 1.2V, these sleek black modules provide a hassle-free boost to your system’s performance
Powerful SODIMM performance
Maximise your memory and get a boost to your gaming, multitasking and rendering.
Plug N Play automatic overclocking functionality*
Impact DDR4 automatically overclocks itself to the highest published frequency.
Intel® XMP-ready and XMP Certified
Designed to maximise the performance of our memory modules, our engineers have predefined Intel Extreme Memory Profiles to reach speeds of up to 3200MT/s.
Ready for AMD Ryzen™
Get memory that’s Ready for AMD Ryzen and will seamlessly integrate with your AMD-based SODIMM-compatible system. A reliable, compatible performance boost for your build.
Higher performance with low power consumption
Run your system cool and efficiently with Impact DDR4’s low 1.2V power draw.
Slim form factor, sleek design
The black PCB and sleek thermal label deliver big style with a small footprint.
CAS latency: 20
Internal memory: 16 GB
Memory layout (modules x size): 1 x 16 GB
Internal memory type: DDR4
Memory data transfer rate: 3200 MT/s
Component for: Laptop
Memory form factor: 260-pin SO-DIMM
Buffered memory type: Unregistered (unbuffered)
Memory ranking: 1
Memory voltage: 1.2 V
Module configuration: 2048M x 64
Row cycle time: 45.75 ns
Refresh row cycle time: 350 ns
Row active time: 26.25 ns
Feature: Intel Extreme Memory Profile (XMP)
Intel Extreme Memory Profile (XMP) version: 2.0
Programming power voltage (VPP): 2.5 V
Cooling type: Heatsink
Feature: JEDEC standard
Operational conditions
Operating temperature (T-T): 0 – 85 °C
Storage temperature (T-T): -55 – 100 °C
Weight & dimensions
Width: 3.8 mm
Depth: 69.6 mm
Height: 30 mm
Weight: 8.3 g
Packaging data
Package width: 57.1 mm
Package depth: 14 mm
Package height: 171.4 mm
Package weight: 25.45 g
Logistics data
Harmonized System (HS) code: 84733020
Products per master (outer) case: 25 pc(s)
Master (outer) case width: 196.8 mm
Master (outer) case length: 311.1 mm
Master (outer) case height: 61 mm
Master (outer) case gross weight: 780.45 g
Other features
Country of origin: China, Taiwan
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