GIGABYTE R263-S30-AAH2. Motherboard chipset: Intel C741, Processor socket: LGA 4677 (Socket E), Processor manufacturer: Intel. Supported memory types: GDDR5, Supported RDIMM clock speeds: 5600,4400 MHz, Memory channels: Octa-channel. Storage drive sizes supported: 2.5,3.5", RAID levels: 0, 1, 5, 10. On-board graphics card model: Aspeed AST2600. Ethernet interface type: Gigabit Ethernet, Ethernet LAN data rates: 10,100,1000 Mbit/s, LAN controller: Intel® I210-AT
Accelerating Artificial Intelligence and Leading Efficiency
Engineering richer features in a revolutionary platform, Intel has made an incredible jump in processor performance in the business transformation journey. AI and deep learning performance will benefit from the built-in AI acceleration engines, while networking, storage, and analytics leverage other specialized accelerators in the 4th & 5th Gen Intel Xeon Scalable processors. Adding a host of new features to target a wide range of workloads, the new families of Intel Xeon processors will deliver even better CPU performance and performance per watt, and do so on a PCIe 5.0 platform with 2x the prior gen throughput to greatly speed up data movement to and from GPUs and storage. Intel also created the Intel Xeon CPU Max Series with High Bandwidth Memory (HBM) for improvements in memory bound HPC and AI workloads. For this new platform, GIGABYTE has products ready to get the most out of Intel Xeon CPU-based systems that support fast PCIe Gen5 accelerators and Gen5 NVMe drives, in addition to support for high performant DDR5 memory.
Engineering richer features in a revolutionary platform, Intel has made an incredible jump in processor performance in the business transformation journey. AI and deep learning performance will benefit from the built-in AI acceleration engines, while networking, storage, and analytics leverage other specialized accelerators in the 4th & 5th Gen Intel Xeon Scalable processors. Adding a host of new features to target a wide range of workloads, the new families of Intel Xeon processors will deliver even better CPU performance and performance per watt, and do so on a PCIe 5.0 platform with 2x the prior gen throughput to greatly speed up data movement to and from GPUs and storage. Intel also created the Intel Xeon CPU Max Series with High Bandwidth Memory (HBM) for improvements in memory bound HPC and AI workloads. For this new platform, GIGABYTE has products ready to get the most out of Intel Xeon CPU-based systems that support fast PCIe Gen5 accelerators and Gen5 NVMe drives, in addition to support for high performant DDR5 memory.
Processor
Motherboard chipset: Intel C741
Processor socket: LGA 4677 (Socket E)
Processor manufacturer: Intel
Processor family: Intel® Xeon®
Number of processors supported: 2
Compatible processor series: Intel® Xeon®
Memory
Number of DIMM slots: 16
Supported memory types: GDDR5
Supported RDIMM clock speeds: 5600,4400 MHz
Memory channels: Octa-channel
Storage
Number of storage drives supported: 13
Feature: Hot-swap HDD bays
Number of 2.5″ bays: 12
Number of 3.5″ bays: 12
Storage drive sizes supported: 2.5,3.5″
RAID levels: 0, 1, 5, 10
Graphics
On-board graphics card model: Aspeed AST2600
Network
Feature: Ethernet LAN
Ethernet interface type: Gigabit Ethernet
Ethernet LAN data rates: 10,100,1000 Mbit/s
LAN controller: Intel® I210-AT
Ports & interfaces
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity: 4
Ethernet LAN (RJ-45) ports: 1
Mini DisplayPorts quantity: 1
Expansion slots
Number of M.2 (M) slots: 1
Features
Feature: Trusted Platform Module (TPM)
Feature: Backplanes support
Design
Chassis type: Rack (2U)
Product colour: Black, Grey
LED indicators: HDD, LAN, Power, System
Feature: On/off switch
Feature: Reset button
Cooling type: Active
Number of fans: 4 fan(s)
Fan diameter: 8 cm
Power
Power supply: 1300 W
Number of main power supplies: 2
AC input voltage: 100 – 240 V
AC input frequency: 50/60 Hz
Input current: 12 – 8 A
80 PLUS certification: 80 PLUS Titanium
Operational conditions
Operating temperature (T-T): 10 – 35 °C
Storage temperature (T-T): -40 – 60 °C
Operating relative humidity (H-H): 8 – 80%
Storage relative humidity (H-H): 5 – 95%
Weight & dimensions
Width: 438 mm
Depth: 710 mm
Height: 87.5 mm
Weight: 26 kg
Packaging data
Packaging content: 1 x R263-S30-AAH21 x CPU heatsink1 x Mini-DP to D-Sub cable3 x Carriers1 x 2-Section Rail ki
Package width: 989 mm
Package depth: 594 mm
Package height: 279 mm
Package weight: 27.5 kg
Motherboard chipset: Intel C741
Processor socket: LGA 4677 (Socket E)
Processor manufacturer: Intel
Processor family: Intel® Xeon®
Number of processors supported: 2
Compatible processor series: Intel® Xeon®
Memory
Number of DIMM slots: 16
Supported memory types: GDDR5
Supported RDIMM clock speeds: 5600,4400 MHz
Memory channels: Octa-channel
Storage
Number of storage drives supported: 13
Feature: Hot-swap HDD bays
Number of 2.5″ bays: 12
Number of 3.5″ bays: 12
Storage drive sizes supported: 2.5,3.5″
RAID levels: 0, 1, 5, 10
Graphics
On-board graphics card model: Aspeed AST2600
Network
Feature: Ethernet LAN
Ethernet interface type: Gigabit Ethernet
Ethernet LAN data rates: 10,100,1000 Mbit/s
LAN controller: Intel® I210-AT
Ports & interfaces
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity: 4
Ethernet LAN (RJ-45) ports: 1
Mini DisplayPorts quantity: 1
Expansion slots
Number of M.2 (M) slots: 1
Features
Feature: Trusted Platform Module (TPM)
Feature: Backplanes support
Design
Chassis type: Rack (2U)
Product colour: Black, Grey
LED indicators: HDD, LAN, Power, System
Feature: On/off switch
Feature: Reset button
Cooling type: Active
Number of fans: 4 fan(s)
Fan diameter: 8 cm
Power
Power supply: 1300 W
Number of main power supplies: 2
AC input voltage: 100 – 240 V
AC input frequency: 50/60 Hz
Input current: 12 – 8 A
80 PLUS certification: 80 PLUS Titanium
Operational conditions
Operating temperature (T-T): 10 – 35 °C
Storage temperature (T-T): -40 – 60 °C
Operating relative humidity (H-H): 8 – 80%
Storage relative humidity (H-H): 5 – 95%
Weight & dimensions
Width: 438 mm
Depth: 710 mm
Height: 87.5 mm
Weight: 26 kg
Packaging data
Packaging content: 1 x R263-S30-AAH21 x CPU heatsink1 x Mini-DP to D-Sub cable3 x Carriers1 x 2-Section Rail ki
Package width: 989 mm
Package depth: 594 mm
Package height: 279 mm
Package weight: 27.5 kg
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