Dynatron B8. Type: Heatsink/Radiator. Width: 80 mm, Depth: 108 mm, Height: 64 mm. Product colour: Aluminium, Copper
B8
Recommend for Intel® Xeon ® Platinum /Gold/Silver/Bronze Family Processor (formerly Cascade Lake, Skylake), Socket FCLGA 3647 Narrow ILM, Aluminum Stacked Fin Soldered on Copper Base with 4x Heat Pipes Embedded for 2U Server & up Solution, Support CPU Power Up to 205 Watts Heat Dissipation.
Recommend for Intel® Xeon ® Platinum /Gold/Silver/Bronze Family Processor (formerly Cascade Lake, Skylake), Socket FCLGA 3647 Narrow ILM, Aluminum Stacked Fin Soldered on Copper Base with 4x Heat Pipes Embedded for 2U Server & up Solution, Support CPU Power Up to 205 Watts Heat Dissipation.
Performance
Suitable location: Processor
Type: Heatsink/Radiator
Supported processor sockets: LGA 3647 (Socket P)
Compatible processor series: Intel® Xeon®
Quantity per pack: 1 pc(s)
Design
Product colour: Aluminium, Copper
Material: Aluminium, Copper
Fins material: Aluminium
Number of heat pipes: 4
Rack capacity: 2U
Power
Thermal Design Power (TDP): 205 W
Weight & dimensions
Width: 80 mm
Depth: 108 mm
Height: 64 mm
Weight: 600 g
Fins thickness: 0.4 mm
Technical details
Compliance certificates: RoHS, WEEE
Other features
Feature: Thermal grease
Suitable location: Processor
Type: Heatsink/Radiator
Supported processor sockets: LGA 3647 (Socket P)
Compatible processor series: Intel® Xeon®
Quantity per pack: 1 pc(s)
Design
Product colour: Aluminium, Copper
Material: Aluminium, Copper
Fins material: Aluminium
Number of heat pipes: 4
Rack capacity: 2U
Power
Thermal Design Power (TDP): 205 W
Weight & dimensions
Width: 80 mm
Depth: 108 mm
Height: 64 mm
Weight: 600 g
Fins thickness: 0.4 mm
Technical details
Compliance certificates: RoHS, WEEE
Other features
Feature: Thermal grease
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